Informacije MIDEM
MIDEM Society - Society for Microelectronics, Electronic Components and Materials
About the journal
Informacije MIDEM is an open-access journal published by MIDEM Society - Society for Microelectronics, Electronic Components and Materials in Slovenia, publishing in english. It is listed in DOAJ according to the sources read. Declared publication charge: 200 EUR. Declared review time at DOAJ: 15 weeks. Facts are reproduced as recorded at their sources with their capture dates; PublishLens indicators are available after sign-in.
Basic facts
- Publisher
- MIDEM Society - Society for Microelectronics, Electronic Components and Materials
- ISSN
- 0352-9045 · 2232-6979
- Country
- Slovenia
- Languages
- english
- Access
- Open access
- Declared publication charge
- 200 EUR
- Articles in DOAJ
- 156
- Declared review time
- 15 weeks
- Declared peer-review model
- peer_review
- Official website
- http://journal.midem-drustvo.si/
Index listings
- DOAJ · 2019-09-25
- Indexing
- DOAJ
- APC
- 200 EUR
- Declared review time (DOAJ)
- 15 weeks — journal-declared only (not measured)
- Activity (OpenAlex)
- Active — latest works 2026
- PublishLens list status
- Shown after sign-in
- Counts for promotion at your university?
- Choose your university and rank below ↓
Methodology signals (dated facts from their sources)
Details of the evaluation under the published methodology are shown to signed-in users (free).
Create a free account to view the evaluationJournal profile
Descriptive metadata from public sources (DOAJ, OpenAlex, PubMed) as of the capture date shown — contains no assessment or judgment.
Articles in DOAJ
156
Most recent article
2 months ago
Average review time (journal-declared via DOAJ)
15weeks
Works in OpenAlex
262
Last recorded publication year
2026
h-index
12
i10-index
16
From OpenAlex open data (CC0).
Editorial & policy10
- Last DOAJ review date
- 2022-09-03
- Added to DOAJ
- 2019-09-25
- Declared plagiarism screening
- Not declared
- Other fees beyond APC
- No
- Editorial board
- Official page ↗
- Norwegian register (HK-dir)— 2026
- Level 1 — approved scholarly channel
- Open references deposited at Crossref
- 0%
- ORCID iDs in current deposits
- 0%
- APC waiver policy
- View policy
- Peer-review policy
- View policy
Identity & continuity1
- Source type
- journal
Classification2
Subjects (DOAJ)
LCC codes
Subject areas
- Analog and Mixed-Signal Circuit Design
- Analog and Mixed-Signal Circuit Design
- Advancements in Semiconductor Devices and Circuit Design
- Advancements in Semiconductor Devices and Circuit Design
- Radio Frequency Integrated Circuit Design
- Radio Frequency Integrated Circuit Design
- Low-power high-performance VLSI design
- Low-power high-performance VLSI design
Show all subjects (50)
- Microwave Engineering and Waveguides
- CCD and CMOS Imaging Sensors
- Advancements in PLL and VCO Technologies
- CCD and CMOS Imaging Sensors
- Advancements in PLL and VCO Technologies
- Microwave Engineering and Waveguides
- Semiconductor materials and devices
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Advanced Memory and Neural Computing
- Advanced Memory and Neural Computing
- Electromagnetic Compatibility and Noise Suppression
- Advanced DC-DC Converters
- Silicon Carbide Semiconductor Technologies
- Advanced DC-DC Converters
- Silicon Carbide Semiconductor Technologies
- Sensor Technology and Measurement Systems
- Sensor Technology and Measurement Systems
- Antenna Design and Analysis
- VLSI and FPGA Design Techniques
- Multilevel Inverters and Converters
- Quantum-Dot Cellular Automata
- Quantum-Dot Cellular Automata
- VLSI and FPGA Design Techniques
- Advanced Adaptive Filtering Techniques
- Multilevel Inverters and Converters
- Neuroscience and Neural Engineering
- Neuroscience and Neural Engineering
- Advanced Adaptive Filtering Techniques
- Energy Harvesting in Wireless Networks
- Thin-Film Transistor Technologies
- Ferroelectric and Piezoelectric Materials
- Electronic Packaging and Soldering Technologies
- Thin-Film Transistor Technologies
- Electronic Packaging and Soldering Technologies
- Ferroelectric and Piezoelectric Materials
- Neural Networks and Applications
- Photonic and Optical Devices
- Photonic and Optical Devices
- Advanced MEMS and NEMS Technologies
- Radiation Effects in Electronics
- Neural Networks and Applications
Keywords (DOAJ)
- microelectronics
- electronic components
- materials
- power electronics
Community confirmations — what users saw in MJL or Scopus Sources; not platform verification and never part of any score.
The journal's record in other sources:Web of Science MJLDOAJ