Additive Manufacturing Letters

Elsevier

Journal websitePeer review: Other
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About the journal

Additive Manufacturing Letters is an open-access journal published by Elsevier in Netherlands, publishing in english. It is listed in DOAJ according to the sources read. Declared publication charge: 1,880 USD. Declared review time at DOAJ: 11 weeks. Facts are reproduced as recorded at their sources with their capture dates; PublishLens indicators are available after sign-in.

Basic facts

Publisher
Elsevier
ISSN
2772-3690
Country
Netherlands
Languages
english
Access
Open access
Declared publication charge
1,880 USD
Articles in DOAJ
379
Declared review time
11 weeks
Declared peer-review model
other

Index listings

  • DOAJ · 2021-11-15
Indexing
DOAJ
APC
1,880 USD
Declared review time (DOAJ)
11 weeks — journal-declared only (not measured)
Activity (OpenAlex)
Active — latest works 2026
PublishLens list status
Shown after sign-in
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Methodology signals (dated facts from their sources)

Details of the evaluation under the published methodology are shown to signed-in users (free).

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Journal profile

Descriptive metadata from public sources (DOAJ, OpenAlex, PubMed) as of the capture date shown — contains no assessment or judgment.

Articles in DOAJ

379

Most recent article

last month

Average review time (journal-declared via DOAJ)

11weeks

Works in OpenAlex

378

Last recorded publication year

2026

Reported by OpenAlex in 2 of 3 sources (CC0 flags, not verified indexing)DOAJSciELOOpenAlex Core

h-index

28

i10-index

134

From OpenAlex open data (CC0).

Editorial & policy11
Last DOAJ review date
2026-04-27
Added to DOAJ
2021-11-15
Declared plagiarism screening
Declared
Other fees beyond APC
No
Declared digital preservation
CLOCKSSPortico
Observed digital preservation (Keepers registry)— snapshot 2026-10-05
CLOCKSSPortico
Editorial board
Official page ↗
Open references deposited at Crossref
99%
ORCID iDs in current deposits
96%
Deposits licence metadata at Crossref
✓
APC waiver policy
View policy
Peer-review policy
View policy
Identity & continuity1
Source type
journal
Classification2

Subjects (DOAJ)

Technology: Technology (General): Industrial engineering. Management engineering

LCC codes

T55.4-60.8

Subject areas

  • Additive Manufacturing Materials and Processes
  • Additive Manufacturing Materials and Processes
  • Additive Manufacturing Materials and Processes
  • Additive Manufacturing and 3D Printing Technologies
  • Additive Manufacturing and 3D Printing Technologies
  • Additive Manufacturing and 3D Printing Technologies
  • High Entropy Alloys Studies
  • High Entropy Alloys Studies
Show all subjects (75)
  • Welding Techniques and Residual Stresses
  • Welding Techniques and Residual Stresses
  • Welding Techniques and Residual Stresses
  • High Temperature Alloys and Creep
  • Powder Metallurgy Techniques and Materials
  • Cellular and Composite Structures
  • Aluminum Alloys Composites Properties
  • Innovations in Concrete and Construction Materials
  • Aluminum Alloys Composites Properties
  • Cellular and Composite Structures
  • Innovations in Concrete and Construction Materials
  • Cellular and Composite Structures
  • Innovations in Concrete and Construction Materials
  • Manufacturing Process and Optimization
  • Solidification and crystal growth phenomena
  • Manufacturing Process and Optimization
  • Advanced Welding Techniques Analysis
  • Advanced materials and composites
  • Advanced materials and composites
  • Surface Treatment and Coatings
  • Laser Material Processing Techniques
  • Titanium Alloys Microstructure and Properties
  • Titanium Alloys Microstructure and Properties
  • Advanced Welding Techniques Analysis
  • Titanium Alloys Microstructure and Properties
  • Advanced Welding Techniques Analysis
  • Laser Material Processing Techniques
  • High-Temperature Coating Behaviors
  • High-Temperature Coating Behaviors
  • Injection Molding Process and Properties
  • Fatigue and fracture mechanics
  • Aluminum Alloy Microstructure Properties
  • Injection Molding Process and Properties
  • Aluminum Alloy Microstructure Properties
  • Metallic Glasses and Amorphous Alloys
  • Aluminum Alloy Microstructure Properties
  • High Entropy Alloys Studies
  • Shape Memory Alloy Transformations
  • Shape Memory Alloy Transformations
  • Aluminum Alloys Composites Properties
  • Nanomaterials and Printing Technologies
  • Advanced Sensor and Energy Harvesting Materials
  • Advanced Materials and Mechanics
  • Microstructure and Mechanical Properties of Steels
  • Surface Treatment and Residual Stress
  • Intermetallics and Advanced Alloy Properties
  • Advanced Sensor and Energy Harvesting Materials
  • Machine Learning in Materials Science
  • Shape Memory Alloy Transformations
  • Intermetallics and Advanced Alloy Properties
  • Mechanical Behavior of Composites
  • Photopolymerization techniques and applications
  • Bone Tissue Engineering Materials
  • Bone Tissue Engineering Materials
  • Laser Material Processing Techniques
  • Photopolymerization techniques and applications
  • High-Temperature Coating Behaviors
  • Metal and Thin Film Mechanics
  • 3D Printing in Biomedical Research
  • High Temperature Alloys and Creep
  • 3D Printing in Biomedical Research
  • High Temperature Alloys and Creep
  • Nanomaterials and Printing Technologies
  • Nanomaterials and Printing Technologies
  • Metal and Thin Film Mechanics
  • Laser-induced spectroscopy and plasma
  • Laser-induced spectroscopy and plasma

Keywords (DOAJ)

  • mechanics of materials
  • engineering
  • industrial engineering
  • manufacturing engineering

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Everything shown here is produced automatically from named sources (DOAJ, OpenAlex, Crossref, PubMed, the Norwegian register) as of its capture date, with no human editing. Facts appear as recorded at the source; derived scores (PCI, PTD, PublishLens score) follow a published methodology. Not a judgement on the journal, not an official accreditation, not advice.

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Norwegian register data: Kanalregisteret (HK-dir, Norway) — CC BY 4.0 / NLOD — adapted: level extracted per year · OASPA member list — CC BY

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