Evaluation status available after sign-in
About the journal
Journal of Microelectronic Manufacturing is an open-access journal published by JommPublish in United States, publishing in english. It is listed in DOAJ according to the sources read. Declared review time at DOAJ: 4 weeks. Facts are reproduced as recorded at their sources with their capture dates; PublishLens indicators are available after sign-in.
Basic facts
- Publisher
- JommPublish
- ISSN
- 2578-3769
- Country
- United States
- Languages
- english
- Access
- Open access
- Articles in DOAJ
- 62
- Declared review time
- 4 weeks
- Declared peer-review model
- other
- Official website
- http://www.jommpublish.org/
Index listings
- DOAJ · 2020-01-06
- Indexing
- DOAJ
- APC
- —
- Declared review time (DOAJ)
- 4 weeks — journal-declared only (not measured)
- Activity (OpenAlex)
- Active — latest works 2025
- PublishLens list status
- Shown after sign-in
- Counts for promotion at your university?
- Choose your university and rank below ↓
Methodology signals (dated facts from their sources)
Details of the evaluation under the published methodology are shown to signed-in users (free).
Create a free account to view the evaluationJournal profile
Descriptive metadata from public sources (DOAJ, OpenAlex, PubMed) as of the capture date shown — contains no assessment or judgment.
Articles in DOAJ
62
Most recent article
5 years ago
Average review time (journal-declared via DOAJ)
4weeks
Works in OpenAlex
62
Last recorded publication year
2025
Reported by OpenAlex in 2 of 3 sources (CC0 flags, not verified indexing)DOAJSciELOOpenAlex Core
h-index
7
i10-index
5
From OpenAlex open data (CC0).
Editorial & policy9
- Last DOAJ review date
- 2020-01-06
- Added to DOAJ
- 2020-01-06
- Declared plagiarism screening
- Not declared
- Other fees beyond APC
- No
- Observed digital preservation (Keepers registry)— snapshot 2026-10-05
- Portico
- Editorial board
- Official page ↗
- Open references deposited at Crossref
- 0%
- ORCID iDs in current deposits
- 0%
- Peer-review policy
- View policy
Identity & continuity1
- Source type
- journal
Classification4
Subjects (DOAJ)
Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networksTechnology: Technology (General): Industrial engineering. Management engineering: Production capacity. Manufacturing capacity
LCC codes
TK452-454.4T58.7-58.8
Subject areas
- Advancements in Photolithography Techniques
- Advancements in Photolithography Techniques
- Advancements in Photolithography Techniques
- Semiconductor materials and devices
- Semiconductor materials and devices
- Semiconductor materials and devices
- Industrial Vision Systems and Defect Detection
- Manufacturing Process and Optimization
Show all subjects (75)
- Manufacturing Process and Optimization
- Economic and Industrial Development
- Asian Industrial and Economic Development
- Advancements in Semiconductor Devices and Circuit Design
- Nanofabrication and Lithography Techniques
- VLSI and FPGA Design Techniques
- Advancements in Semiconductor Devices and Circuit Design
- Advancements in Semiconductor Devices and Circuit Design
- Block Copolymer Self-Assembly
- Advanced optical system design
- Industrial Vision Systems and Defect Detection
- Industrial Vision Systems and Defect Detection
- Advanced Materials and Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
- Advanced Neural Network Applications
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
- Nanofabrication and Lithography Techniques
- Advanced Surface Polishing Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Electronic Packaging and Soldering Technologies
- VLSI and Analog Circuit Testing
- Electron and X-Ray Spectroscopy Techniques
- Nanofabrication and Lithography Techniques
- Low-power high-performance VLSI design
- VLSI and Analog Circuit Testing
- Electron and X-Ray Spectroscopy Techniques
- Advanced X-ray Imaging Techniques
- 3D IC and TSV technologies
- Manufacturing Process and Optimization
- Plasma Diagnostics and Applications
- Nanowire Synthesis and Applications
- Nanowire Synthesis and Applications
- Advanced Measurement and Metrology Techniques
- Plasma Diagnostics and Applications
- Photonic and Optical Devices
- Mechatronics Education and Applications
- Optical Coatings and Gratings
- Engineering Applied Research
- Optical Coatings and Gratings
- Mechatronics Education and Applications
- Semiconductor Lasers and Optical Devices
- Engineering Applied Research
- Educational Reforms and Innovations
- Advanced Numerical Methods in Computational Mathematics
- Advanced Measurement and Metrology Techniques
- Semiconductor Lasers and Optical Devices
- Plasma Diagnostics and Applications
- Photonic and Optical Devices
- Copper Interconnects and Reliability
- Advanced Measurement and Metrology Techniques
- Semiconductor Lasers and Optical Devices
- Electronic Packaging and Soldering Technologies
- Educational Reforms and Innovations
- Copper Interconnects and Reliability
- Advanced MEMS and NEMS Technologies
- 2D Materials and Applications
- Magnetic properties of thin films
- GaN-based semiconductor devices and materials
- ZnO doping and properties
- ZnO doping and properties
- Magnetic properties of thin films
- GaN-based semiconductor devices and materials
Keywords (DOAJ)
- semiconductor manufacutring
- microelectronics
- integrated circuit
- device
- simulation
- process
Community confirmations — what users saw in MJL or Scopus Sources; not platform verification and never part of any score.
Loading community confirmations…
The journal's record in other sources:Web of Science MJLDOAJ